BGA Reballing Stencil For Qualcomm MTK CPU RAM IC Chip

★ ★ ★ ★ ★
Reviews | Questions & Answers
AU $21.30 ~ 21.78
Price includes 10% AU GST

Color :
Quantity
In Stock. Ships in 24 hours
Shipping: AU $0.00
Estimated Delivery on -
Secure Payment
Multiple payment options
Customer Service Guarantee
DOA Guarantee Missing/Wrong Items Guarantee Quality Guarantee No Reason Returns
Product Features
  • This BGA reballing stencil for Qualcomm MTK CPU RAM IC chips is made of stainless steel with a 0.12MM thickness, ensuring high-precision reballing.
  • It is applicable to Qualcomm SM7450/SM8550/MT6799W/SDM439/MTK/CPU, providing a professional solution for commercial manufacture.
  • With no high-concerned chemicals, it is safe to use in the reballing process of various chips.
  • Originating from Mainland China, it meets high-quality standards and offers a reliable option for chip reballing.
  • Ideal for electronics repair and manufacturing, this stencil helps achieve accurate and efficient reballing of BGA chips.
Specifications
Hign-concerned Chemical
None
Type
Hand Tool Parts
Model Number
Tin mesh
Material
Stainless steel
Use
Commercial Manufacture
product name
Tin mesh
brand
AMAOE
thickness
0.12MM
apply to
Qualcomm SM7450/SM8550/MT6799W/SDM439/MTK/CPU
Packge
Reballing Stencil
semi_Choice
yes
1122 Sold
Reviews
0 out of 5
★ ★ ★ ★ ★
See all 0 Reviews
5 star
1 (33%)
4 star
2 (67%)
3 star
0 (0%)
2 star
0 (0%)
1 star
0 (0%)
Checking product compliance...
Enquiry
Ask a Question
captcha