BGA Reballing Stencil 0.12mm Amaoe SAM 17 BGA Reballing Stencil Template Samsung S22 S22+ S22Ultra Series Exynos2200/E9925/ SM845

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Product Features
  • The BGA reballing stencil with a 0.12mm thickness is precisely designed for the Amaoe SAM 17 and Samsung S22 series. It ensures accurate reballing for Exynos2200/E9925/SM845 chips.
  • Made for hand-tool parts, this stencil template is a reliable choice for professional repairers. Its high-precision design guarantees excellent performance in reballing tasks.
  • It's an essential tool for those working on Samsung S22 S22+ S22Ultra series devices. The 0.12mm thickness allows for fine-tuned reballing operations.
  • This BGA reballing stencil is suitable for various models in the Samsung S22 range. It provides a cost-effective solution for chip reballing needs.
  • With its precise design and high-quality construction, this stencil is perfect for reballing the specified Samsung chips. It simplifies the repair process for technicians.
Specifications
Type
Hand Tool Parts
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