Soldering wire RELIFE 0.3/0.4/0.5/0.6mm Active Rosin Core Tin Wire 20g for Mobile Phone Motherboard BGA Welding Repair

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AU $11.07 ~ 11.13
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Product Features
  • This soldering wire with a diameter of 0.3/0.4/0.5/0.6mm and a weight of 20g is suitable for mobile phone motherboard BGA welding repair.
  • It has active rosin core, which helps to improve the soldering quality and efficiency during electronic component welding.
  • It can be used for electrical repair and IC repair, providing a reliable solution for electronic device maintenance.
  • The 20G rosin welding line ensures a sufficient amount of solder for multiple welding tasks.
  • Certified with CE, it meets the quality standards for electronic soldering applications.
Specifications
Weight
20g
Diameter
0.3/0.4/0.5/0.6mm
Item name
Tin Lead Solder Wire
Features 1
Electrical Repire, IC Repire
Features 2
Soldering wire
Features 3
Electronic Components welding
Features 4
20G Rosin welding lin
Brand Name
SFDER
Model Number
Soldering Wire
Material
Tin
Hign-concerned Chemical
None
semi_Choice
yes
4103 Sold
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