Universal Adjustable Temperature CPU Heating Platform Maant SL-1 For Phone Chip CPU Glue Removal Solder Removal BGA Reballing

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AU $55.00
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Product Features
  • This universal adjustable temperature CPU heating platform, the Maant SL-1, can heat from 160-250℃, suitable for phone chip CPU glue removal, solder removal, and BGA reballing.
  • It features functions like low-pressure heating plate, heating without a soldering iron, and non-absorbent tin ribbon, providing efficient and safe chip repair solutions.
  • With a working size of 20*18.5mm, this heating platform is designed for precise and detailed chip-related operations.
  • Originating from Mainland China, the Maant SL-1 is a reliable tool for professional phone repair technicians and DIY enthusiasts.
  • Whether you're dealing with chip degumming or reballing, this adjustable temperature heating platform offers the flexibility and performance needed for successful repairs.
Specifications
Brand Name
MAANT
Model Number
Maant SL-1
Function 1
Heating
Function 2
Chip/phone /CPU Degumming
Function 3
Low pressure heating plate
Function 4
Heating Without A Soldering Iron
Function 5
Non-Absorbent Tin Ribbon
Function 6
Air Gun Heating
Heating temperature
160-250℃
Working size
20*18.5mm
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