Thermal Paste Thermal Glue ZEXEF Thermal Pads Conductive Heatsink Glue 5g Plaster Viscous Adhesive Glue For Chip VGA RAM LED IC Cooler Radiator Cooling

Product Features

This thermal paste is a 5g silicone sealant with high thermal conductivity (>0.671W/m-K), suitable for chips, VGA, RAM, and other electronic components.
It has a short ging time of 3min at 25°C and low evaporation (0.001% at 200°C/24 Hours), ensuring stable performance.
The conductive glue can effectively transfer heat, keeping the electronic devices cool and improving their performance.
With a strength of connected buildings of 1.5map and a scatter coefficient of <0.005, it provides reliable adhesion.
Originating from Mainland China, this thermal paste offers a high-quality solution for electronic cooling needs.

Specifications

Hign-concerned Chemical

None

DIY Supplies

ELECTRICAL

Model Number

Circuit board adhesive

Type

Silicone Sealant

Melting amount

0 (200°C/24 Hours)

Thermal Conductivity

>0.671W/m-K

Ging Time

3min (25°C)

Strength of Connected Buildings

1.5map

Scatter Coefficient

<0.005

Feature 2

Conductive glue

Feature 4

hot glue for chips

Specifications

5g (single)

Evaporation

0.001% (200°C/24 Hours)

Impedance

<0.06

Track Strength

25Kg

Margin Coefficient

>5.1

Feature 1

heatsink plaster

Feature 3

thermal conductive glue

Feature5

thermal glue

Description

542 Sold

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