Thermal Pad 21W/mk 100X50 Thermal Conductive Pad Sheet 1mm 1.5mm 2mm 3mm 100X100 Silicon Thermal Gap Pads Cpu Gpu

Product Features

This thermal pad with a thermal conductivity of 21W/mk is made of silicone and TIM, suitable for GPU, CPU, and other electronic equipment.
Available in different dimensions (100*100/100*50) and thicknesses (0.5-3.0mm), you can choose the right one for your needs.
It has a breakdown voltage of ≥6 KV/mm and a density of 3.2±0.2 g/cm³, ensuring reliable performance.
The grey color and solid pattern make it a practical and aesthetically pleasing option for electronic heat dissipation.
Originating from Mainland China, it is a high-quality thermal pad for various electronic applications.

Specifications

Brand Name

FEHONDA

Type

Thermal Pad

Hign-concerned Chemical

None

Model Number

21w

Material

Silicone,TIM

Thermal Conductivity

Dimension

100*100/100*50

Product Name

Market 21w Thermal Pad

color

Grey

Size

100*50/100*100

Thickness

0.5/0.75/1.0/1.25/1.5/1.75/2.0/2.25/2.5/2.75/3.0

Hardness

30-45 Shore C

Breakdown Voltage

≥6 KV/mm

Density (±0.3)

3.2±0.2 g/cm³

Application

GPU/CPU/PC/Video card/laptop/other electronic equipment

semi_Choice

yes

Description

Thermal Pad 21W/mk 100X50 Thermal Conductive Pad Sheet 1mm 1.5mm 2mm 3mm 100X100 Silicon Thermal Gap Pads Cpu Gpu

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