U-QSU6 BGA Reballing Stencil For Snapdragon 8 Ultra 8s 7s Gen3 7Gen3 SM8750 SM8635 SM7635 SM6450 SM7435 SM8650 SM4450 SM7550 Net phone repair tools,tool kit,phone repair kit

Product Features

This U-QSU6 BGA reballing stencil is designed for Snapdragon 8 Ultra 8s 7s Gen3 and other models. It is a useful tool for net phone repair, with a single-piece included.
Made in Mainland China, this stencil is made of other materials and has no magnetic feature. It is easy to use and provides accurate reballing for phone repair.
The stencil is suitable for various phone models, such as SM8750, SM8635, etc. It is a practical and functional tool for phone repair technicians.
With its specific design for Snapdragon chips, this stencil ensures precise reballing, helping to improve the repair quality of your phone.
This BGA reballing stencil is a great choice for those who are involved in phone repair. It is a reliable and cost-effective tool for phone repair needs.

Specifications

Hign-concerned Chemical

None

Pieces Included

Material

other

With Magnetic

Model Number

U-QSU6

Description

1804 Sold

Reviews

0 out of 5

★ ★ ★ ★ ★

See all 0 Reviews

5 star

1 (100%)

4 star

0 (0%)

3 star

0 (0%)

2 star

0 (0%)

1 star

0 (0%)

Checking product compliance...

Enquiry

Ask a Question