MECHANIC Lead-Free Solder Paste Soldering Flux Welding Tin Paste For Mobile Phone PCB BGA SMD Repair Tools solder paste

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AU $13.39 ~ 21.00
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Product Features
  • This lead-free solder paste is ideal for mobile phone PCB, BGA, and SMD repair, providing a safe and reliable soldering solution.
  • With a particle size of 25-48μm and a melting point of 138℃/217℃, it offers precise soldering performance.
  • Certified by RoHS, it meets environmental standards, ensuring a healthy working environment.
  • Available in different gross weights like 20g/35g/40g/42g/60g, it can meet various soldering needs.
  • As a BGA soldering station rework tool, it helps technicians complete repair tasks efficiently.
Specifications
Brand Name
MECHANIC
Hign-concerned Chemical
None
Model Number
MECHANIC Solder Paste
Particle Size
25-48μm
Melting Point
138℃/217℃
Gross Weight
20g/35g/40g/42g/60g
Type
Soldering tin paste
Function
BGA Soldering Station Rework Tools
Feature
Lead-Free
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