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Product Features

This PCB board assembly has a board thickness of 0.2-4.0mm, a min. hole size of 0.1mm, and a min. line spacing of 0.08mm, suitable for various electronic applications.
It is made in China with a copper thickness of 1OZ-8OZ and a base material of FR-4, ensuring high-quality and reliable performance.
The surface finishing of OSP lead-free HAL immersion gold provides excellent conductivity and corrosion resistance.
It can be customized according to specific requirements, making it a flexible solution for different projects.
With its advanced manufacturing technology and customizable features, this PCB board assembly is a great choice for electronic product development.

Specifications

Hign-concerned Chemical

None

Board Thickness

0.2-4.0mm

Min. Hole Size

0.1mm

Min. Line Spacing

0.08mm

Copper Thickness

1OZ-8OZ

Base Material

FR-4

Min. Line Width

0.08mm

Surface Finishing

OSP Lead free HAL Immersion gold

Description

2332 Sold

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