Leaded BGA Solder balls 25K/Bottle For IC Chip Soldering Reballing Ball Sn63Pb37 Tin Material 0.2-0.76MM Rework Accessories

Product Features

These leaded BGA solder balls, 25K per bottle, are made of Sn63Pb37 tin material for IC chip soldering reballing.
Available in sizes from 0.2-0.76MM, they offer flexibility for different chip repair needs.
They are suitable for laptop, game console, and cell phone chip repair reballing.
Made in Mainland China, they meet the RoHs and SGS standards for quality and safety.
With a silver color and appropriate weight, they are easy to handle and use in soldering work.

Specifications

Pieces Included

Material

Tin

With Magnetic

Model Number

25K/Bottle Leaded BGA Solder Balls 0.2-0.76MM

Name

BGA Leaded Solder Ball

Size

0.2mm/0.25/0.3mm/0.35mm/0.4mm/0.45mm/0.5mm/0.55/0.6mm/0.65mm/0.76mm

Color

Sliver

Weight

app.30-200g

App to

Laptop, game console, cell phone chip repair reballing

Quantity

25,000PCS per Bottle

Balls Alloy

Sn63/Pb37

Standard

RoHs Available & SGS Tested

shipping number

1bottle

Description

4004 Sold

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