MECHANIC XG Series 183℃ Tin Solder Paste Environment Friendly Soldering Flux for Mobile Phone IC CPU BGA SMD Phone Repair solder paste

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AU $19.98 ~ 25.67
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Product Features
  • This MECHANIC XG Series tin solder paste is environment-friendly, suitable for mobile phone IC, CPU, BGA, and SMD phone repair at 183℃.
  • It has CE certification, ensuring its quality and safety for use in electronic device repair.
  • Originating from Mainland China, it is a reliable choice for professional phone repair technicians.
  • The solder paste provides a strong and stable connection, ensuring the proper functioning of repaired mobile phones.
  • It helps to solve various phone repair problems, making it an essential tool for mobile phone repair workshops.
Specifications
Hign-concerned Chemical
Lead and lead compounds
4905 Sold
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