BGA Stencil For HUAWEI P30 Mate 20 Pro 20X 20RS Magic 2 HI3680 CPU Stencil Replanting tin seed beads BGA

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AU $21.96
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Product Features
  • This BGA stencil is specifically designed for HUAWEI P30, Mate 20 Pro and other models, enabling accurate replanting of tin seed beads.
  • It is made with high-precision manufacturing technology, ensuring precise alignment during the soldering process.
  • Designed to fit the HI3680 CPU, it provides a reliable solution for BGA soldering operations.
  • It helps to improve the soldering quality and efficiency, reducing the risk of soldering defects.
  • Its use can enhance the overall performance and reliability of the electronic devices.
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