170 / 400 / 830 Tie Points Solderless Breadboard MB-102 BB-801 SYB-170 Prototype Universal PCB Jumper Dupont Test Bread Board solderless breadboard

Product Features

This solderless breadboard with 170/400/830 tie points is suitable for prototyping and testing electronic circuits.
It has a busboard hole-diameter of 0.9mm and a hole-pitch of 2.54mm/0.1 inches for precise connections.
With a 300V supply voltage and low current dissipation power, it is suitable for various electronic projects.
Customizable options are available, and it is a new product with a single-side prototyping design.
Made in Mainland China, it meets the needs of hobbyists and professionals in electronics.

Specifications

Dissipation Power

Big Low Current Less than 5A BB830 for USB Esp32 Wire

Low Current

<5A

Busboard Hole-diameter

0.9 mm

Thickness

10mm

Hole-pitch

2.54 mm / 0.1 inches

Brand Name

CHANZON

Hign-concerned Chemical

None

Package

SMD

Operating Temperature

Single Side Prototyping Solderable Boards pins for Small Rasp Project

Condition

New

Type

Voltage Regulator

Supply Voltage

300V MB 102 / BB 801 / SYB 170 High Frequency Terminal Protoboard

semi_Choice

yes

Description

429 Sold

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