BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm For BGA Rework Repair MECHANIC solder balls

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AU $17.96 ~ 19.55
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Product Features
  • These BGA reballing balls with diameters from 0.2 to 0.76mm are essential for BGA rework repair in mobile phone repair tools.
  • Made of tin and sourced from Mainland China, they are free from certification requirements and are reliable for repair work.
  • The various diameter options allow for precise repair work, ensuring compatibility with different BGA components.
  • These solder balls are a key component in the mobile phone repair process, providing a strong and stable connection.
  • With their high-quality material and wide range of sizes, they are a must-have for any professional mobile phone repair technician.
Specifications
Application
Mobile Phone Repair Tools
Material
Tin
Diameter
0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
Model Number
solder tin
2747 Sold
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