Polyimide Tape Polyimide Adhesive Tape 33M/Roll High Temperature Heat Resistant Electronic Insulation for BGA PCB 3D Printing Board Protection

Product Features

This polyimide tape is 33M/roll, with a thickness of 0.06mm, offering high-temperature heat resistance up to 250/300Deg. C for BGA PCB and 3D printing board protection.
Featuring RoHS certification, this polyimide adhesive tape is safe and compliant with environmental standards, suitable for electronic insulation.
With an elongation of 50% and a tensile strength of 42N/25mm, this tape provides excellent flexibility and durability.
This polyimide tape's peel force of 26N/25mm ensures a strong and reliable adhesion, protecting the PCB and 3D printing boards effectively.
Designed for 3D printer tape and electrical DIY supplies, this polyimide tape is a versatile and practical choice for various electronic applications.

Specifications

Model Number

3-30mm

Hign-concerned Chemical

None

DIY Supplies

Electrical

Type

Tape

Tape Type

3D Printer Tape

Material

Polymide

High Temperature Resistance

250/300Deg.C

Thickness

0.06mm

Packing

33meter/roll

Elongation

50%

Tensile Strength

42N/25mm

Peel Force

26N/25mm

Voltage Grade

2500 - 3000V

semi_Choice

yes

Description

Polyimide Tape Polyimide Adhesive Tape 33M/Roll High Temperature Heat Resistant Electronic Insulation for BGA PCB 3D Printing Board Protection

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