Thermal Paste for Chip VGA RAM LED IC Cooling

Product Features

This thermal paste for chip, VGA, RAM, LED, and IC cooling has a high thermal conductivity of >0.671W/m-K, ensuring efficient heat dissipation.
It has low evaporation (0.001% at 200°C/24 Hours) and melting amount (0 at 200°C/24 Hours), providing stable performance.
With an impedance of <0.06 and a ging time of 3min at 25°C, it offers reliable electrical and thermal properties.
It has a high track strength of 25Kg and a strength of connected buildings of 1.5map, ensuring a strong bond.
With sufficient stock, it is a reliable choice for DIY metalworking and electronics cooling needs.

Specifications

Hign-concerned Chemical

None

DIY Supplies

Metalworking

Model Number

Heatsink Plaster

Specifications

5g (single)

Melting amount

0 (200°C/24 Hours)

Evaporation

0.001% (200°C/24 Hours)

Thermal Conductivity

>0.671W/m-K

Impedance

<0.06

Ging Time

3min (25°C)

Track Strength

25Kg

Strength of Connected Buildings

1.5map

Margin Coefficient

>5.1

Scatter Coefficient

<0.005

Stock

Sufficient

Type1

Chip Adhesive Glue

Type2

VGA Plaster Glue

Type3

Thermal Pads Conductive Heatsink Plaster

Description

Thermal Paste for Chip VGA RAM LED IC Cooling

3567 Sold

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